Double-layer shutter control method of multi-sputtering system

Details Double-layer shutter control method of multi-sputtering system Double-layer shutter control method of multi-sputtering system

2005-03-14

2010-12-14

Nguyen, Nam X (Department: 1795)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S192120, C204S298110, C204S298260

Reexamination Certificate

active

07850827

ABSTRACT:
A double-layer shutter control method of a multi-sputtering system provided with three targets in a single chamber and a double-layer rotating shutter mechanism having shutter plates which independently rotate and have holes formed therein, comprising selecting a target by a combination of holes of a first shutter plate and a second shutter plate and uses the selected target for a pre-sputtering step and a main sputtering step with continuous discharge so as to deposit a film on a substrate, whereby it is possible to prevent cross-contamination between targets due to target substances etc. deposited on the shutter plates.

REFERENCES:
patent: 3864239 (1975-02-01), Fletcher et al.
patent: 4576699 (1986-03-01), Sato et al.
patent: 6051113 (2000-04-01), Moslehi
patent: 2002/0064595 (2002-05-01), Nomura et al.
patent: 2004/0084305 (2004-05-01), Fukuchi et al.

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