Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – On insulating substrate or layer
Patent
1997-10-01
1999-10-19
Bowers, Charles
Semiconductor device manufacturing: process
Formation of semiconductive active region on any substrate
On insulating substrate or layer
438149, 438166, H01L 2100, H01L 2120
Patent
active
059703679
ABSTRACT:
The present invention is a technique for producing silicon-on-insulator MOS transistors by damascene patterning of source-drain regions in a thin film of amorphous silicon deposited on a layer of oxide grown on a silicon wafer, where the oxide has previously been etched with a pattern of trenches. In addition, the technique provides for the amorphous layer to contact the underlying silicon substrate through multiple small oxide openings; where these openings have been previously filled with amorphous silicon, planarized and annealed at high temperature to form single crystal silicon; and where subsequent transistor channel regions will align to these filled openings. After patterning, the wafer is annealed in a second high temperature cycle, where the regions of amorphous silicon in contact with the single crystal silicon in the openings will convert into single crystal silicon suitable for transistor channel regions.
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Bowers Charles
Sulsky Martin
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