Dotted contact solar cell and method of making same

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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136252, 156644, 156651, 156657, 204 15, 21912169, 21912171, 437 2, B44C 122, C03C 1500, C03C 2506

Patent

active

050115650

ABSTRACT:
A method of applying metallized contacts to a solar cell substrate, the front surface of which is covered with a dielectric layer. The method involves forming a plurality of apertures extending through the dielectric layer using a laser beam and defining a grid-shaped electrode. The apertures comprise a plurality of microscopically-sized holes that are arranged in a series of rows, with the holes being spaced a relatively short distance from one another. Nickel is plated onto the portions of the substrate exposed through the apertures. The nickel plating is then overcoated with copper which is preferably applied by a contactless light-induced plating process. The copper plating process causes copper to be deposited so that it bridges over the dielectric layer between the holes so as to form an integrated grid electrode structure.

REFERENCES:
patent: 4691077 (1987-09-01), Gregory et al.
patent: 4703553 (1987-11-01), Mardesich
patent: 4754544 (1988-07-01), Hanak
patent: 4818337 (1989-04-01), Barnett et al.

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