Doped Y 2 O 3 buffer layers for laminated conductors

Details Doped Y 2 O 3 buffer layers for laminated conductors Doped Y 2 O 3 buffer layers for laminated conductors

2007-08-21

2007-08-21

McNeil, Jennifer (Department: 1775)

Stock material or miscellaneous articles

Composite

Of metal

C428S701000, C428S702000

Reexamination Certificate

active

11192488

ABSTRACT:
A laminated conductor includes a metallic substrate having a surface, a biaxially textured buffer layer supported by the surface of the metallic substrate, the biaxially textured buffer layer comprising Y2O3and a dopant for blocking cation diffusion through the Y2O3, and a biaxially textured conductor layer supported by the biaxially textured buffer layer.

REFERENCES:
patent: 5595960 (1997-01-01), Belouet et al.
patent: 6077344 (2000-06-01), Shoup et al.
patent: 6150034 (2000-11-01), Paranthaman et al.
patent: 6156376 (2000-12-01), Paranthaman et al.
patent: 6159610 (2000-12-01), Paranthaman et al.
patent: 6235402 (2001-05-01), Shoup et al.
patent: 6270908 (2001-08-01), Williams et al.
patent: 6399154 (2002-06-01), Williams et al.
patent: 6428920 (2002-08-01), Badding et al.
patent: 6440211 (2002-08-01), Beach et al.
patent: 6537689 (2003-03-01), Schoop et al.
patent: 6596421 (2003-07-01), Schmidt et al.
patent: 6649570 (2003-11-01), Belouet
patent: 6663976 (2003-12-01), Beach et al.
patent: 2005/0217568 (2005-10-01), Rupich et al.
C.C. Wang, et al., “Effect of zirconia doping on the electrical behavior of yttria,” J of Materials Research, 1996, pp. 422-429, vol. 11, No. 2.

Affiliated with

Also associated with

Rating

Doped Y 2 O 3 buffer layers for laminated conductors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Doped Y 2 O 3 buffer layers for laminated conductors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Doped Y 2 O 3 buffer layers for laminated conductors will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3886573