Dissolution of metals utilizing a H.sub.2 O.sub.2 -H.sub.2 SO.su

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156664, 252 794, C23F 100

Patent

active

041742532

ABSTRACT:
Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and an effective amount of a mono- or dihydroxy-substituted cycloparaffin.

REFERENCES:
patent: 3556883 (1971-01-01), Naito et al.
patent: 3801512 (1974-04-01), Solenberger
patent: 4040863 (1977-08-01), Kitamura

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