Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-09-19
2006-09-19
Lee, Sin (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S326000, C430S905000, C430S907000, C430S311000, C430S271100, C430S272100
Reexamination Certificate
active
07108953
ABSTRACT:
The invention relates to a photoresist composition comprising a polymeric binder; a photoactive component; and at least one dissolution inhibitor comprising a paraffinic or cycloparaffinic compound containing at least one functional group having the structure —C(Rf)(Rf′)OR wherein Rfand Rf′ are the same or different fluoroalkyl groups of from one or taken together are (CF2)awherein a is an integer ranging from 2 to about 10 and R is a hydrogen atom or an acid labile protecting group. Typically, the dissolution inhibitor has an absorption coefficient of less than about 4.0 μm at a wavelength of 157 nm.
REFERENCES:
patent: 2004/0023157 (2004-02-01), Feiring et al.
patent: 2005/0191579 (2005-09-01), Feiring et al.
patent: 42 07 261 (1993-09-01), None
patent: 1 035 441 (2000-09-01), None
patent: WO 00/17712 (2000-03-01), None
patent: WO 00/25178 (2000-05-01), None
L. F. Thompson, C. G. Willson, and M. J. Bowden, “Organic Resist Materials”, Introduction to Microlithography, 1994, pp. 139-267, Second Edition, American Chemical Society, Washington, DC.
E. Reichmanis et al., “The Effect of Substituents on the Photosensitivity of 2-Nitrobenzyl Ester Deep U.V. Resists,” J. Electrochem. Soc., 1983, pp. 1433-1437, vol. 130.
K. Patterson, et al., “Polymers for 157 nm Photoresist Applications: A Progress Report,” Proceedings of the SPIE, The International Society for Optical Engineering, 2000, pp. 365-374, vol. 39999, No. 1, XP-002200721.
K. J. Przybilla, et al., “Hexafluoroacetone in Resist Chemistry: A Versatile New Concept for Materials for Deep UV Lithography,” Proceedings of the SPIE, The International Society for Optical Engineering, 1992, pp. 500-512, vol. 1672, No. 1, XP 000912223.
Berger Larry L.
Feiring Andrew E.
Feldman Jerald
Petrov Viacheslav Alexandrovich
Schadt, III Frank L.
E. I. du Pont de Nemours and Company
Lee Sin
LandOfFree
Dissolution inhibitors in photoresist compositions for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Dissolution inhibitors in photoresist compositions for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dissolution inhibitors in photoresist compositions for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3583119