Displacement sensor including a heat insulating member partition

Details Displacement sensor including a heat insulating member partition Displacement sensor including a heat insulating member partition

1993-11-22

1995-01-31

Turner, Samuel A.

Optics: measuring and testing

By dispersed light spectroscopy

Utilizing a spectrometer

356363, 250237G, G01B 902

Patent

active

053862910

ABSTRACT:
A displacement sensor is disclosed, which permits a semiconductor laser to be used as a light source with less thermal effects thereof. A spindle 18 with a scale 32 mounted thereon is disposed in a housing 11 or displacement. In the housing are also provided a semiconductor laser 35 for projecting a laser beam onto the scale and a transducer 36 for converting light form the scale into an electric signal. A heat insulation arrangement 41 is provided between the semiconductor laser 35 and the scale 32 to prevent transmission of heat from the semiconductor laser 35 to the scale 32. A heat radiation arrangement for radiating heat from the semiconductor laser 35 to the outside of the housing 11 is mounted in the housing 11. Thus, thermal effects of the semiconductor laser 35 on the scale 32 are reduced, and thus the accuracy of measurement is improved.

REFERENCES:
patent: 4676645 (1987-06-01), Taniguchi et al.
patent: 4691987 (1987-09-01), Ebner et al.
patent: 5283434 (1994-02-01), Ishizuka et al.

Affiliated with

Also associated with

Rating

Displacement sensor including a heat insulating member partition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Displacement sensor including a heat insulating member partition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Displacement sensor including a heat insulating member partition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1105579