Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-09-04
2007-09-04
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
Reexamination Certificate
active
11129886
ABSTRACT:
An interconnect system between an integrated circuit device and a printed circuit board may include a filter portion coupled to conductors on a power distribution bus. The filter portion may reduce radiated emissions produced during operation of the integrated circuit. The interconnect may include dispersive elements. The dispersive elements may be less electrically conductive of current in a higher frequency range than in a lower frequency range. In some embodiments, the second level interconnect may include a socket having dispersive contacts. The contacts may be coupled to core power conductors on the power distribution bus.
REFERENCES:
patent: 4557225 (1985-12-01), Sagues et al.
patent: 6532439 (2003-03-01), Anderson
patent: 6571184 (2003-05-01), Anderson
patent: 6573590 (2003-06-01), Radu et al.
patent: 6597575 (2003-07-01), Matayabas et al.
patent: 6789241 (2004-09-01), Anderson
patent: 6850828 (2005-02-01), Chen
patent: 6944025 (2005-09-01), Hockanson
patent: 6956285 (2005-10-01), Radu et al.
patent: 2004/0062020 (2004-04-01), Leung
patent: 2005/0029482 (2005-02-01), Johnson et al.
patent: 2005/0062154 (2005-03-01), Duchesne et al.
Hockanson David M.
Slone Rodney D.
Stoutamire Charlotte E.
Getachew Abiy
Kivlin B. Noäl
Meyertons Hood Kivlin Kowert & Goetzel P.C.
Reichard Dean A.
Sun Microsystems Inc.
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