Dispersive interconnect system for EMI reduction

Details Dispersive interconnect system for EMI reduction Dispersive interconnect system for EMI reduction

2007-09-04

2007-09-04

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

11129886

ABSTRACT:
An interconnect system between an integrated circuit device and a printed circuit board may include a filter portion coupled to conductors on a power distribution bus. The filter portion may reduce radiated emissions produced during operation of the integrated circuit. The interconnect may include dispersive elements. The dispersive elements may be less electrically conductive of current in a higher frequency range than in a lower frequency range. In some embodiments, the second level interconnect may include a socket having dispersive contacts. The contacts may be coupled to core power conductors on the power distribution bus.

REFERENCES:
patent: 4557225 (1985-12-01), Sagues et al.
patent: 6532439 (2003-03-01), Anderson
patent: 6571184 (2003-05-01), Anderson
patent: 6573590 (2003-06-01), Radu et al.
patent: 6597575 (2003-07-01), Matayabas et al.
patent: 6789241 (2004-09-01), Anderson
patent: 6850828 (2005-02-01), Chen
patent: 6944025 (2005-09-01), Hockanson
patent: 6956285 (2005-10-01), Radu et al.
patent: 2004/0062020 (2004-04-01), Leung
patent: 2005/0029482 (2005-02-01), Johnson et al.
patent: 2005/0062154 (2005-03-01), Duchesne et al.

Affiliated with

Also associated with

Rating

Dispersive interconnect system for EMI reduction does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dispersive interconnect system for EMI reduction, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dispersive interconnect system for EMI reduction will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3739240