Dislocation removal from a group III-V film grown on a...

Active solid-state devices (e.g. – transistors – solid-state diode – Including semiconductor material other than silicon or... – Group iii-v compound

Reexamination Certificate

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C257S616000

Reexamination Certificate

active

07863710

ABSTRACT:
Dislocation removal from a group III-V film grown on a semiconductor substrate is generally described. In one example, an apparatus includes a semiconductor substrate, a buffer film including a group III-V semiconductor material epitaxially coupled to the semiconductor substrate wherein the buffer film includes material melted by laser pulse irradiation and recrystallized to substantially remove dislocations or defects from the buffer film, and a first semiconductor film epitaxially grown on the buffer film wherein a lattice mismatch exists between the semiconductor substrate and the first semiconductor film.

REFERENCES:
patent: 5901165 (1999-05-01), Uchida
patent: 7091108 (2006-08-01), Tolchinsky et al.
patent: 2007/0123003 (2007-05-01), Brask et al.
Sakai, “MOCVD Growth of III-V compunds on Si using strained superlatticec” Mat. Res Soc. Symp. Proc. vol. 67, p. 15-27.
Hudait, Mantu K., et al., “Semiconductor Buffer Architecture for III-V Devices on Silicon Substrates”, U.S Application filed Aug. 2, 2006 assigned U.S. Appl. No. 11/498,685.
Hudait, Mantu K., et al., “Dislocation-Free INSB Quantum Well Structure on Si Using Novel Buffer Architecture”, U.S Application filed Aug. 2, 2006 assigned U.S. Appl. No. 11/501,253.
Hudait, Mantu K., et al., “Stacking Fault and Twin Blocking Barrier for Integrating III-V on Si”, U.S Application filed Aug. 2, 2006 assigned U.S. Appl. No. 11/498,901.
Hudait, Mantu K., et al., “SB-Based CMOS Device”, U.S Application filed Aug. 16, 2006 assigned U.S. Appl. No. 11/560,494.
Hudait, Mantu K., et al., “Buffer Layers for Device Isolation of Devices Grown on Silicon”, U.S Application filed Sep. 27, 2006 assigned U.S. Appl. No. 11/527,785.
Shaheen, Mohamad A., et al., “Thin III-V Semiconductor Films With High Electron Mobility”, U.S Application filed Dec. 4, 2006 assigned U.S. Appl. No. 11/633,953.
Datta, Suman et al., “Insulated Gate for Group III-V Devices”, U.S Application filed Dec. 13, 2006 assigned U.S. Appl. No. 11/610,415.
Hudait, Mantu K., et al., “A Buffer Architecture Formed on a Semiconductor Wafer”, U.S Application filed Mar. 1, 2007 assigned U.S. Appl. No. 11/712,614.
Chui, Chi O., et al., “Forming a Type I Heterostructure in a Group IV Semiconductor”, U.S Application filed Mar. 27, 2007 assigned U.S. Appl. No. 11/728,890.
Chui, Chi O., et al., “Forming a Non-Planar Transistor Having a Quantum Well Channel”, U.S Application filed Mar. 27, 2007 assigned U.S. Appl. No. 11/728,891.
Jin, Been Y., et al., “Transistor Having Tensile Strained Channel and System Including Same”, U.S Application filed Mar. 29, 2007 assigned U.S. Appl. No. 11/729,564.
Hudait, Mantu K., et al., “High Hole Mobility Semiconductor Device”, U.S Application filed Jun. 28, 2007 assigned U.S. Appl. No. 11/823,516.

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