Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1995-09-06
1998-03-03
Breneman, R. Bruce
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419216, 2041922, 427129, 427130, 427131, 427596, 427554, 427555, 216 65, 216 94, C23C 1434, B05D 300
Patent
active
057230331
ABSTRACT:
The invention provides discrete track magnetic recording media and methods for their fabrication. A discrete track servo pattern is imposed on an underlayer, over which a magnetic recording layer is deposited. The pattern is preferably imposed by selective laser ablation of the underlayer. Ideally the underlayer comprises sputtered carbon, which has been found to improve the signal-to-noise ratio of the subsequent magnetic layer. Optionally, a contact start/stop zone having a relatively rough surface texture is imposed, also by selective laser ablation of the underlayer.
REFERENCES:
patent: 4833020 (1989-05-01), Shiroishi et al.
patent: 4893299 (1990-01-01), Humberstone et al.
patent: 5062021 (1991-10-01), Ranjan et al.
patent: 5108781 (1992-04-01), Ranjan et al.
patent: 5344720 (1994-09-01), Belt et al.
patent: 5567484 (1996-10-01), Baumgart et al.
D. Dericotte et al., "Advancements in the Development of Plastic Hard Disks with Pre-Embossed Servo Patterns," Corporate Research Laboratories, SONY Corporation.
S.E. Lambert et al., "Beyond Discrete Tracks: Other Aspects of Patterned Media," J. Appl. Phys. 69 (8), Apr. 1991, pp. 4724-4726.
Akashic Memories Corporation
Breneman R. Bruce
McDonald Rodney G.
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