Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-10-29
1993-08-03
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156634, 156645, 156656, 156902, 29852, 427 97, 428209, 428901, B44C 122, C23F 100
Patent
active
052325482
ABSTRACT:
A multilayer, three-dimensional wiring matrix is fabricated from a plurality of individually testable plane pair sub-units (30). Each of the plane pair sub-units (30) includes a compensator (20) with capping layers (32) laminated on either side. The compensator (20) has a dielectric (14) encapsulated foil (10) which has been patterned with holes (12). Metallization patterns on the surfaces of the compensator (20) provide orthogonal wiring (22), electrical connections (24) to the foil (10), and electrical connections (26) between the top and bottom surfaces. The capping layer (32) includes joining metallurgy (38) at selected locations within a dielectric layer (36) that is in registry with the metallization in the vias (16). The joining metallurgy (38) may be a metal loaded thermoplastic and provides a seal for the vias (16) as well as planarizes the structure. The capping layers (32) may be formed in-situ on the compensator or separately.
REFERENCES:
patent: 2692190 (1954-10-01), Pritikin
patent: 3181986 (1965-05-01), Pritikin
patent: 3465435 (1969-09-01), Steranko
patent: 3466206 (1969-09-01), Beck
patent: 3541222 (1970-11-01), Parks et al.
patent: 3554877 (1971-01-01), Geisler
patent: 3606677 (1967-12-01), Ryan
patent: 4604160 (1986-08-01), Murakami et al.
patent: 4642160 (1987-02-01), Burgess
patent: 4707657 (1987-11-01), Boegh-Petersen
patent: 4830691 (1989-05-01), Kida et al.
patent: 4830704 (1989-05-01), Voss et al.
patent: 4970106 (1990-11-01), DiStefano et al.
Ehrenberg Scott G.
Herron L. Wynn
Miersch Ekkehard F.
Park Jae
Poetzinger Janet L.
International Business Machines - Corporation
Powell William A.
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