Discrete die burn-in for nonpackaged die

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324765, G01R 1073, G01R 3128

Patent

active

060912510

ABSTRACT:
A reusable burn-in/test fixture for discrete TAB die consists of two halves. The first half of the test fixture contains cavity in which die is inserted. When the two halves are assembled, the fixture establishes electrical contact with the die and with a burn-in oven. The test fixture need not be opened until the burn-in and electrical test are completed. The fixture permits the die to be characterized prior to assembly.

REFERENCES:
patent: 4169642 (1979-10-01), Mouissie
patent: 4585991 (1986-04-01), Reid
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4891585 (1990-01-01), Janko et al.
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4906920 (1990-03-01), Huff et al.
patent: 4912399 (1990-03-01), Greub et al.
patent: 4918383 (1990-04-01), Huff et al.
patent: 4968931 (1990-11-01), Littlebury et al.
patent: 5014161 (1991-05-01), Lee et al.
patent: 5072289 (1991-12-01), Sugimoto et al.
patent: 5073117 (1991-12-01), Malhi et al.
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5117439 (1992-05-01), Liu et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5180977 (1993-01-01), Huff
patent: 5225037 (1993-07-01), Elder et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5543725 (1996-08-01), Lim et al.
patent: 5815000 (1998-09-01), Farnworth et al.
patent: 5825195 (1998-10-01), Hembree et al.
patent: 5878485 (1999-03-01), Wood et al.
patent: 5896036 (1999-04-01), Wood et al.
patent: 5949242 (1999-09-01), Wood et al.
"Decal Contractor With Decoder", #32636, Research Disclosure, No. 326, Jun. 1991.
Yamamoto et al., "Evaluation of New-Micro Connection Ssystem Using Microbumps", ISHM '93 Proceedings.
Miyake et al, Connectivity Analysis of New `Known Good Die` Connection System Using Microbumps, Jan., 1994.

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