Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent
1996-10-25
2000-07-04
Padgett, Marianne
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
427539, 427563, 427579, 438788, 438710, 216 67, B05D 314, B05D 304, H01L 213105
Patent
active
060835699
ABSTRACT:
A method and apparatus for neutralizing a wafer in a plasma reactor following a deposition process which charges the wafer and hinders removal of the wafer from the plasma reactor. The wafer is exposed to a plasma of a noble gas such as helium to energize the reaction zone. Then a sufficient amount of an inert electronegative gas such as oxygen to neutralize the wafer is introduced into the plasma reactor in the absence of RF power or other gases. The neutralized wafer is readily removed from the plasma chamber.
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Gupta Anand
Shahreza Majid K.
Applied Materials Inc.
Padgett Marianne
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