Directly solderable three-dimensional electrically conductive ci

Details Directly solderable three-dimensional electrically conductive ci Directly solderable three-dimensional electrically conductive ci

1985-11-07

1989-05-02

Nguyen, Nam X.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

4284735, 428901, 20419214, 20419215, B32B 300, C23C 1434

Patent

active

048267201

ABSTRACT:
Novel directly solderable three-dimensional electrically conductive circuit components are made by forming firmly adherent metal coatings on smooth thermoplastic substrates, e.g., polyether imides, by sputtering the metal directly onto the substrate, without any surface preparation or treatment of the substrate, under sputtering conditions which cause at least a portion of the sputtered metal, e.g., copper, to be imbedded into and below the substrate surface. Another metal coating can be provided by sputtering, or electro or electroless deposition over the sputter-deposited coating.

REFERENCES:
patent: 4101698 (1978-07-01), Dunning et al.
patent: 4294877 (1981-10-01), Graham
patent: 4313995 (1982-02-01), Delgadillo
patent: 4344996 (1982-08-01), Banks et al.
patent: 4364792 (1982-12-01), Gliem et al.
patent: 4466874 (1984-08-01), Belke, Jr. et al.
patent: 4482598 (1984-11-01), Ishii et al.
patent: 4525261 (1985-06-01), Hotta et al.

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