Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With gas inlet structure
Reexamination Certificate
2007-05-15
2007-05-15
Lund, Jeffrie R. (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With gas inlet structure
C156S345240, C156S345260, C156S345330, C118S715000, C118S692000, C118S696000, C118S708000, C700S121000, C700S123000, C700S175000
Reexamination Certificate
active
10482210
ABSTRACT:
A method and system (1) for utilizing shaped orifices (e.g., sonic and simple orifices, and divergent nozzles) in the gas inject system (20) as part of a plasma process system. By utilizing the shaped orifices, directionality of gas flow (25) can be improved. This improvement is especially beneficial in high aspect ratio processing.
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The International Preliminary Examination Report PCT/US02/16583.
Lund Jeffrie R.
Tokyo Electron Limited
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