Direct temperature sensing of a semiconductor device semiconduct

Thermal measuring and testing – Temperature measurement – By electrical or magnetic heat sensor

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257470, 327512, G01K 700, H01L 31058, H01L 3500, H03K 1778

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06149299&

ABSTRACT:
An apparatus and method for directly measuring the operating temperature of a semiconductor device. A temperature sensor is placed directly on the substrate containing the device whose temperature is of interest. The circuitry used to process the sensor signals is on a separate substrate. Because the sensor is on the same substrate as the device of interest, noise is produced in the sensor signals as a result of electrons injected into the substrate by the device. The present invention includes methods for cancelling the noise and error in the temperature measurements to provide a very accurate determination of the device's operating temperature.

REFERENCES:
patent: 5100829 (1992-03-01), Fay et al.
patent: 5195827 (1993-03-01), Audy et al.
patent: 5349336 (1994-09-01), Nishiura et al.
patent: 5401099 (1995-03-01), Nishizawa et al.
Tektronix, Inc., Tektronix Products 1973; New Product Summary, p. 67.

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