Direct patterning of metals over a thermally inefficient surface

Details Direct patterning of metals over a thermally inefficient surface Direct patterning of metals over a thermally inefficient surface

1990-10-12

1992-04-14

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 21912169, B44C 122, C23F 102

Patent

active

051044803

ABSTRACT:
Conductive patterns may be formed on the surface of thermally inefficient substrates by depositing a uniform layer of metal thereover whose upper surface is substantially UV light absorbing followed by laser ablation of the deposited metal to leave the deposited metal only in the desired metal pattern. Thermally efficient substrates may be rendered thermally inefficient by the deposition of a thermally inefficient material thereon. That thermally inefficient material may be either electrically insulating or a metal. A two layer metallization comprising a first, thermally inefficient reactive metal and a second UV light absorbing metal is preferred. When disposed on a thermally inefficient substrate, this two layer metallization ablates reactively as the two layers burn off together. This laser ablation process substantially roughens the surface of polymer dielectrics and may be used to repair open traces in printed circuit structures.

REFERENCES:
patent: 3867217 (1975-02-01), Maggs et al.
patent: 4037075 (1977-07-01), Pugsley et al.
patent: 4259433 (1981-03-01), Mizobuchi et al.
patent: 4874920 (1989-10-01), Yamazaki et al.

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