Direct current sputtering of boron from boron/coron mixtures

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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20419216, 20429808, 20429809, C23C 1434

Patent

active

053726863

ABSTRACT:
A method for coating a substrate with boron by sputtering includes lowering the electrical resistance of a boron-containing rod to allow electrical conduction in the rod; placing the boron-containing rod inside a vacuum chamber containing substrate material to be coated; applying an electrical potential between the boron target material and the vacuum chamber; countering a current avalanche that commences when the conduction heating rate exceeds the cooling rate, and until a steady equilibrium heating current is reached; and, coating the substrate material with boron by sputtering from the boron-containing rod.

REFERENCES:
patent: 4594294 (1986-06-01), Eichen et al.
patent: 4629547 (1986-12-01), Honda et al.
patent: 4683043 (1987-07-01), Melton et al.
patent: 5013604 (1991-05-01), Allen et al.
patent: 5203977 (1993-04-01), Makowiecki et al.
"New Techniques for Sputtering Pure Boron and Boron-Carbon Compositions", Abstract-Poster Paper for Thirty-Third Annual Meeting, Division of Plasma Physics, Nov. 4, 1991.

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