Direct coupled CPU package

Details Direct coupled CPU package Direct coupled CPU package

1992-09-30

1998-05-19

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 88B, 361735, 361775, 439259, H05H 720

Patent

active

057543992

ABSTRACT:
An improved packaging scheme for a CPU of a main frame computer improves the performance while at the same reduces the cost of manufacture of the main frame computer. A single packaging technology is used to package the whole CPU and eliminates cable connections inside the CPU. Surface power bus technology permits the fabrication of a module with chips mounted on both front and back sides of the substrate. The surface power bus is installed on one or both sides of the module surface and derives power directly from the power cable and distributes power to chip sites directly. In a specific implementation, a uni-processor CPU with chips mounted on both surfaces of the substrate and power fed from the surface power bus results in improved processor package density and system performance. The direct coupling between the high performance processor CPU and a high cost performance ratio ceramic board not only eliminates a great portion of hardware but also reduces a significant portion of the memory path and channel path delays.

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