Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-06-07
1998-08-18
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361772, 257738, 438614, 22818022, H01L 23532
Patent
active
057965919
ABSTRACT:
A structure and a method is disclosed for making a laminated circuit carrier card for the purpose of making a Direct Chip Attached Module (DCAM) with low cost and high reliability. The carrier is made using an organic or an inorganic laminated carrier having at least one surface available for direct chip mount. The chip has at least one solder ball with a cap of low melting point metal. The surface of the carrier has electrical features that are directly connected to the low melting point metal on the solder ball of the chip to form the eutectic and this way the chip is directly attached to the carrier.
REFERENCES:
patent: 4505029 (1985-03-01), Owyang et al.
patent: 4967950 (1990-11-01), Legg et al.
patent: 4999699 (1991-03-01), Christie et al.
patent: 5007163 (1991-04-01), Pope et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5130779 (1992-07-01), Agarwala et al.
patent: 5147084 (1992-09-01), Behun et al.
patent: 5188280 (1993-02-01), Nakao et al.
patent: 5251806 (1993-10-01), Agarwala et al.
patent: 5431328 (1995-07-01), Chang et al.
patent: 5439162 (1995-08-01), George et al.
patent: 5470787 (1995-11-01), Greer
patent: 5611481 (1997-03-01), Akamatsu et al.
patent: 5698465 (1997-12-01), Lynch et al.
W. A. Dawson et al., "Indium-Lead-Indium Chip Joining", IBM Technical Disclosure Bulletin, vol. 11, No. 11, Apr. 1969, p. 1528.
Microelectronics Packaging Handbook, edited by Rao R. Tummala & Eugene J. Rymaszewski, SR28-4413-00, pp. 366-391.
Dalal Hormazdyar Minocher
Fallon Kenneth Michael
Ahsan Aziz M.
Blecker Ira D.
International Business Machines - Corporation
Picard Leo P.
Vigushin John B.
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