4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Kenneth Michael Fallon

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Direct chip attach circuit card

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Electronic module with multiple solder dams in soldermask window

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Electroplating apparatus

Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent

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Method for forming reflowed solder ball with low melting...

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate

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Method of making electronic module with multiple solder dams in

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent

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Profile ID: LFUS-PAI-P-88639

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