Diode-laser module with a bonded component and method for bondin

Details Diode-laser module with a bonded component and method for bondin Diode-laser module with a bonded component and method for bondin

1997-03-26

1999-07-27

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438106, 438121, 438122, H01L 2144, H01L 2148, H01L 2150

Patent

active

059306009

ABSTRACT:
A method for bonding a component (14) to a substrate (18) via a thermally hardened or softened bonding medium, employs PTC or NTC thermistor (24) for heating the bonding medium during bonding of the component. In one disclosed example, the method is used for bonding an optical fiber to a substrate, via a solder layer (40), in alignment with a semiconductor laser (12) in a diode-laser module (10).

REFERENCES:
patent: 3600650 (1971-08-01), Obenhaus et al.
patent: 4766409 (1988-08-01), Mandaz
patent: 4798439 (1989-01-01), Preston
patent: 4990987 (1991-02-01), Boucher et al.
Brochure, "PTC Thermistors for Self-Regulating Heaters", by Advanced Thermal Products, Inc., Data Sheet P493, 2 pages in length.

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