4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Jorg Lawrenz-Stolz

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Assembly for focusing and coupling the radiation produced by a s

Optical waveguides – With optical coupler – Input/output coupler
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Diode-laser module with a bonded component and method for bondin

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
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Laser

Coherent light generators – Particular beam control device – Nonlinear device
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Profile ID: LFUS-PAI-P-1078354

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