Diode encapsulation glass

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...

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C03C 310

Patent

active

040186130

ABSTRACT:
Small semiconductive devices such as diodes are encapsulated in glass sleeving composed of a PbO--K.sub.2 O--Al.sub.2 O.sub.3 --B.sub.2 O.sub.3 --SiO.sub.2 glass exhibiting good alkali durability and specified thermal expansion characteristics in combination with a reduced softening temperature.

REFERENCES:
patent: 2018816 (1935-10-01), Taylor
patent: 2018817 (1935-10-01), Taylor
patent: 2210489 (1940-08-01), Lemmens et al.
patent: 2736714 (1956-02-01), Tiede
patent: 2830000 (1958-04-01), Labins
patent: 3535133 (1970-10-01), Akhtar
patent: 3723835 (1973-03-01), Davis et al.

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