Diode and applications thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Reexamination Certificate

active

07372109

ABSTRACT:
A diode with low substrate current leakage and suitable for BiCMOS process technology. A buried layer is formed on a semiconductor substrate. A connection region and well contact the buried layer. Isolation regions are adjacent to two sides of the buried layer, each deeper than the buried layer. The isolation regions and the buried layer isolate the connection zone and the well from the substrate. The first doped region in the well is a first electrode. The well and the connection region are electrically connected, acting as a second electrode.

REFERENCES:
patent: 5892264 (1999-04-01), Davis et al.
patent: 6878605 (2005-04-01), Kim et al.
patent: 7095092 (2006-08-01), Zhu et al.
patent: 2002/0109190 (2002-08-01), Ker et al.
patent: 2002/0153586 (2002-10-01), Majumdar et al.
patent: 2003/0047750 (2003-03-01), Russ et al.
“Characteristics of Low-Leakage Deep-Trench Diode for ESD Protection Design in 0.18-μm SiGe BiCMOS Process” Chen et al.; Jul. 2003.
“Low-Leakage Diode String Designs Using Triple-Well Technologies for RF-ESD Applications” Chen et al.; Sep. 2003.
“ESD Protection in a Mixed Voltage Interface and Multi-Rail Disconnected Power Grid Environment in 0.50 and 0.25-μm Channel Length CMOS Technologies” Voldman; 1994.
“Designing On-Chip Power Supply Coupling Diodes for ESD Protection and Noise Immunity” Dabral et al.; 1993.
“Core Clamps for Low Voltage Technologies” Dabral et al.; 1994.

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