Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Patent
1998-10-29
2000-06-20
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
257737, H01L 2348
Patent
active
060781033
ABSTRACT:
An improved electrical connection between a metal surface and a semiconductor surface is provided by the deposition of a conductive dimple on the metal surface, whereby the conductive dimple is interposed between the metal surface and the semiconductor substrate. For example, a conductive trace deposited on an insulating substrate may have a conductive dimple formed thereon. A semiconductor substrate, such as a silicon substrate, may be bonded to the insulating substrate over at least a portion of the metal trace having the dimple thereon to form an electrical connection between the semiconductor substrate and the conductive trace.
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Jr. Carl Whitehead
McDonnell Douglas Corporation
Potter Roy
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