Dimple-free tungsten plug

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

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Details

257764, 257765, 257753, H01L 2348, H01L 2940, H01L 2954, H01L 2962

Patent

active

056729146

ABSTRACT:
A new method of metallization using a dimple-free tungsten plug is described. Semiconductor device structures are formed in and on a semiconductor substrate. An insulating layer is deposited overlying the semiconductor device structures. An opening is etched through the insulating layer to contact one of the semiconductor device structures. A layer of tungsten is deposited overlying the insulating layer and within the opening. The tungsten layer is coated with a layer of spin-on-glass wherein the spin-on-glass layer planarizes the top surface of the substrate. The spin-on-glass and tungsten layers are etched back leaving the tungsten layer only within the opening as a tungsten plug wherein the presence of the spin-on-glass layer overlying the tungsten layer prevents the formation of a dimple within the tungsten plug completing the formation of the dimple-free tungsten plug in the fabrication of an integrated circuit.

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patent: 5523624 (1996-06-01), Chen et al.
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patent: 5623166 (1997-04-01), Olowolafe et al.

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