Digital microelectronic circuit package using buffer dies and pr

Details Digital microelectronic circuit package using buffer dies and pr Digital microelectronic circuit package using buffer dies and pr

1996-04-16

1998-07-14

Shah, Alpesh M.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

361736, G06F 1300

Patent

active

057817910

ABSTRACT:
A digital microelectronic replacement package includes at least one buffer die in combination with a programmable device or memory. The buffer die performs the functions of impedance-matching, delay-matching, and voltage-matching, while the programmable device or memory can be used to emulate the logic and/or storage functions of the original digital microelectronic circuit; the package of the invention can be used as a direct replacement for a digital microelectronic circuit without the requirement that the original circuit board be redesigned to accommodate modern voltage, impedance, and delay specifications associated with the programmable device or memory.

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