Diffusion system

Details Diffusion system Diffusion system

2004-08-06

2008-11-18

Zervigon, Rudy (Department: 1792)

Coating apparatus

Gas or vapor deposition

Multizone chamber

C118S715000, C156S345310, C156S345330, C156S345370

Reexamination Certificate

active

07452423

ABSTRACT:
Provided is a diffusion system for forming a doping layer in a wafer. The diffusion system includes a bubbler for generating a doping gas; a premixer, which premixes the doping gas with reactive gases and preheats the gas mixture; a main chamber, in which the gas mixture reacts to the wafer; a buffer case, which externally isolates an exhaust port and a door for loading and unloading the wafer into and out or the main chamber; and a used gas exhaustion system, which exhausts a used gas after the reaction is finished in the main chamber.

REFERENCES:
patent: 3808035 (1974-04-01), Stelter
patent: 4566918 (1986-01-01), Irvine et al.
patent: 4783343 (1988-11-01), Sato
patent: 5118286 (1992-06-01), Sarin
patent: 5186120 (1993-02-01), Ohnishi et al.
patent: 5252062 (1993-10-01), Groves et al.
patent: 5462899 (1995-10-01), Ikeda
patent: 5489550 (1996-02-01), Moslehi
patent: 5575854 (1996-11-01), Jinnouchi et al.
patent: 5989345 (1999-11-01), Hatano
patent: 6015594 (2000-01-01), Yoshikawa
patent: 6263831 (2001-07-01), Gorin
patent: 2002/0036066 (2002-03-01), Ogawa et al.
patent: 54-134100 (1979-10-01), None
patent: 59 049829 (1984-03-01), None
patent: 98/30731 (1998-07-01), None
patent: WO 99/09233 (1999-02-01), None
patent: 03/048413 (2003-06-01), None
Partial European Patent Office Search Report.
European Search Report dated Apr. 25, 2005.
Chinese Office Action dated Apr. 6, 2007 and English translation.

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