Diffusion bonded sputter target assembly and method of making

Details Diffusion bonded sputter target assembly and method of making Diffusion bonded sputter target assembly and method of making

1999-08-17

2000-06-06

Diamond, Alan

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429813, 228115, 228116, 228164, 228165, 228174, 228203, 228194, 228195, 428650, 428655, 428687, 428615, 419 48, 419 49, C23C 1434, B23K 2000

Patent

active

060713895

ABSTRACT:
A sputter target assembly includes a cobalt target diffusion bonded to an aluminum or copper backing plate by means of a titanium interlayer. The sputter target assembly may be made by hot vacuum pressing or, preferably, by hot isostatically pressing the target, interlayer and backing plate together. Preferably, the titanium interlayer is provided as a foil, but may also be formed on a mating surface of either the target or the backing plate by electroplating, sputtering, electroless plating, or plasma spraying. The target may be advantageously machined with grooves defining salient points prior to providing the interlayer.

REFERENCES:
patent: 4135286 (1979-01-01), Wright et al.
patent: 4731116 (1988-03-01), Kny
patent: 4838935 (1989-06-01), Dunlop et al.
patent: 5215639 (1993-06-01), Boys
patent: 5230459 (1993-07-01), Mueller et al.
patent: 5234487 (1993-08-01), Wickersham et al.
patent: 5244556 (1993-09-01), Inoue
patent: 5693203 (1997-12-01), Ohhashi et al.
patent: 5836506 (1998-11-01), Hunt et al.
patent: 5857611 (1999-01-01), Gilman et al.
patent: 5904966 (1999-05-01), Lippens

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