Electroplating workpiece fixture having liquid gap spacer

Details Electroplating workpiece fixture having liquid gap spacer Electroplating workpiece fixture having liquid gap spacer

1998-05-29

2000-06-06

Bell, Bruce F.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204297W, 204286, 204287, 204224R, C25D 1704

Patent

active

060713887

ABSTRACT:
A fixture for supporting a workpiece during electroplating of a metal upon the workpiece in a conductive electroplating bath includes a non-conductive frame member for receiving the workpiece therein. The fixture further includes a current distribution means having a plurality of contacts. The plurality of contacts is disposed inwardly for providing an equally distributed electrical contact with an outer perimeter region of the workpiece. The workpiece is supported between the frame member and the current distribution means. Lastly, a thief electrode is perimetrically disposed about the workpiece and spaced a prescribed distance from the workpiece by a gap region. During plating of a metal upon the workpiece, the gap region between the thief and the workpiece is filled with the conductive electroplating bath. An electroplating apparatus having a fixture for supporting a workpiece during an electroplating process and a method of supporting the workpiece to be electroplated are also disclosed.

REFERENCES:
patent: 3421994 (1969-01-01), Leduc
patent: 3511758 (1970-05-01), Bedi et al.
patent: 4302316 (1981-11-01), Nester
patent: 4532017 (1985-07-01), Keinborg et al.
patent: 4626331 (1986-12-01), Goto et al.
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4821466 (1989-04-01), Kato et al.
patent: 4861449 (1989-08-01), Onge
patent: 4934102 (1990-06-01), Leach et al.
patent: 5078801 (1992-01-01), Malik
patent: 5167792 (1992-12-01), Komitokahara et al.
patent: 5168887 (1992-12-01), Thompson et al.
patent: 5225034 (1993-07-01), Yu et al.
patent: 5240552 (1993-08-01), Yu et al.
patent: 5449313 (1995-09-01), Kordonsky et al.
patent: 5464519 (1995-11-01), Tomba et al.
patent: 5492594 (1996-02-01), Burke et al.
patent: 5516412 (1996-05-01), Andricacos et al.
patent: 5522975 (1996-06-01), Andricacos et al.
patent: 5534106 (1996-07-01), Cote et al.
patent: 5543032 (1996-08-01), Datta et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5575706 (1996-11-01), Tsai et al.
patent: 5620581 (1997-04-01), Ang
patent: 5624300 (1997-04-01), Kishii et al.
patent: 5637185 (1997-06-01), Murarka et al.
patent: 5685766 (1997-11-01), Mattingly et al.
patent: 5744019 (1998-04-01), Ang
patent: 5755859 (1998-05-01), Brusi et al.
patent: 5793272 (1998-08-01), Burghartz et al.
patent: 5807165 (1998-09-01), Uzoh et al.
Mehdizadeh, et al., Optimization of Electrodeposit Uniformity by the Use of Auxiliary Electrodes, 1990, J. Electrochem. Soc., vol. 137, No. 1.
S. Mehdizadeh, et al, "Optimization of Electrodeposit Uniformity by the Use of Auxiliary Electrodes" Jrl. of Electrochemical Soc., vol. 137, #1, Jan. 1990, pp. 110-117.
U.S. Pat. Pending application Ser. No. 09/406,644 Entitled: Electroplating Workpiece Fixture Having Liquid Gap Spacer by Uzoh.

Affiliated with

Also associated with

Rating

Electroplating workpiece fixture having liquid gap spacer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroplating workpiece fixture having liquid gap spacer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating workpiece fixture having liquid gap spacer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2210635