Differential pressure CVD chuck

Details Differential pressure CVD chuck Differential pressure CVD chuck

1992-03-11

1995-01-24

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

Work support

118719, 118724, C23C 1600, C23C 1646

Patent

active

053839714

ABSTRACT:
An apparatus for preventing edge and backside coating during CVD processing supports a wafer on flexible supports within a purge cavity in a pedestal such that a movable clamp ring deforms the supports, forms a slot with the frontside of the wafer around the periphery of the wafer and by contacting the pedestal isolates the purge cavity from the coating chamber except for the slot. The wafer is heated by a pyrolytic carbon heater in the cavity and purge gas is fed to the purge cavity to flow through the slot and purge coating gas from diffusing into the purge cavity to coat the heater or the edge or backside of the wafer. In an alternative embodiment plural pedestals allow processing of plural wafers in a single cycle, and a vacuum lock and automatic handling devices are provided.

REFERENCES:
patent: 4512391 (1985-04-01), Harra
patent: 4857142 (1989-08-01), Syverson
patent: 4990374 (1991-02-01), Keeley et al.
patent: 5000113 (1991-03-01), Wang et al.
patent: 5033407 (1991-07-01), Mizuno et al.
patent: 5090900 (1992-02-01), Rudolf et al.
patent: 5094885 (1992-03-01), Selbrede
patent: 5230741 (1993-07-01), Van de Ven et al.
Solid State Technology, "Tungsten exclusion ring controls deposition area", p. 26, Aug. 1991.

Affiliated with

Also associated with

Rating

Differential pressure CVD chuck does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Differential pressure CVD chuck, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Differential pressure CVD chuck will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1465978