Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2006-09-29
2008-10-21
Siek, Vuthe (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C327S065000
Reexamination Certificate
active
07441222
ABSTRACT:
Disclosed is a connection arrangement for connecting end portions of differential pairs to pads. In the arrangement, first and second signal traces comprising the differential pair are formed in first and second layers, respectively, of a printed circuit board. Each of the signal traces has a run portion and an end portion. The end portions of the first and second signal traces are connected, respectively, to first and second pads. At the beginning of the end portions in a region of the printed circuit board on a first lateral side of the first pad both the first and second signal traces split into two branches. One branch each from the first and second signal traces traverses a path around a top side of the first pad and the remaining branches from the first and second signal traces traverse a path around the bottom side of the first pad. The branches of the first and second signal traces come together again in a region of the printed circuit board on a second lateral side of the first pad. A terminal portion of the first signal trace extends away from the region where the two branches of the first signal trace come together again and contacts the first pad. A terminal portion of the second signal trace extends away from the region where the two branches of the second signal trace come together again in a direction away from the first pad and towards the second pad, and contacts the second pad. A projection of the run and branch portions of the second signal trace in a plane of the first layer overlaps the run and branch portions of first signal trace up to the point where the branches come together again.
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patent: 2007/0207674 (2007-09-01), Minich
Harrington & Smith PC
Lin Aric
Nokia Corporation
Siek Vuthe
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