Dielectric material and process to create same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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Details

257296, 257298, 257313, 257649, H01L 2972

Patent

active

059775815

ABSTRACT:
An embodiment of the present invention describes a method for forming a dielectric material for a storage capacitor during fabrication of a semiconductor memory device, by: cleaning impurities from the surface of a conductive plate of the storage capacitor; forming a nitride film over the conductive plate's cleaned surface; forming a metal silicide film over the nitride film; and oxidizing the metal silicide film by rapid thermal oxide (RTO) processing. A resulting structure is a capacitor having a dielectric material that is an oxidized metal silicide film.

REFERENCES:
patent: 4690730 (1987-09-01), Tang et al.
patent: 4949162 (1990-08-01), Tamaki et al.
patent: 5471418 (1995-11-01), Tanigawa

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