Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1990-01-08
1993-11-09
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430312, 430313, 430317, 427 96, G03C 558
Patent
active
052601706
ABSTRACT:
A dielectric layered sequentially processed circuit board is disclosed. A first photodefinable resin containing an electroless plating catalyst is disposed on a substrate and portions of the substrate are exposed through the first resin. A second photodefinable resin absent the electroless plating catalyst is disposed on the first resin, and portions coincident with the exposed portions of the substrate as well as portions of the first resin are exposed through the second resin. A conductive material is deposited on the exposed portions of the substrate and the exposed portions of the first resin.
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Moriya et al., "High-Density Multilayer Interconnection with Photo-Sensitive Polyimide Dielectric and Electroplating Conductor", IEEE 34th Electronic Components Conference May 1984, pp. 82-87.
Dote Janis L.
Jenski Raymond A.
McCamish Marion E.
Motorola Inc.
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