Dielectric layer structure and manufacturing method thereof

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

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C438S622000, C257SE21576

Reexamination Certificate

active

07858532

ABSTRACT:
A method for fabricating a dielectric layer structure includes providing a substrate, forming at least a low-k dielectric layer on the substrate, forming a single tensile layer on the low-k dielectric layer, and performing a moisture preventing treatment on the single tensile film. The single tensile layer possesses a stress comparative to a stress of the low-k dielectric layer and a hydrophobic characteristic that prevents itself from absorbing moisture.

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