Dielectric drying of fungal material and resultant textured prod

Details Dielectric drying of fungal material and resultant textured prod Dielectric drying of fungal material and resultant textured prod

1976-05-06

1977-11-01

Golian, Joseph M.

Food or edible material: processes, compositions, and products

Direct application of electrical or wave energy to food...

Involving dielectric heating or passage of electric current...

426656, 426802, A23J 300, A23J 118

Patent

active

040566382

ABSTRACT:
A proteinaceous mass of fungal mycelial fibers is treated by rapid dielectric heating to reduce the moisture content by from 8 to 40 weight percent to give a product with a solids level of 30 to 70 weight percent, and preferably a solids level of 40 to 60 weight percent. The initial proteinaceous mass may be pretreated such as by aqueous thermal shock to reduce the nucleic acid content, before it is formed into fiber bundles of from 0.2 to 1.0 mm. in diameter, and having an average length to diameter ratio of greater than 20. These bundles are interconnected by groups of hyphae or by single hyphal with average diameter of from 0.004 to 0.01 mm. and length to diameter ratio of from 10 to 1000. The dielectric heating process puffs and crosslinks (heat sets) the product which then may be further dried such as in a hot air oven to reduce the moisture content of the mass to the desired level below 10 weight percent. The product is rehydratable to 1 to 5 and preferably 1.5 to 3.0 times its dry weight to yield a form having a texture and chewability resembling meat.

REFERENCES:
patent: 3249446 (0000-01-01), Tooby
patent: 3662673 (1972-05-01), Boyer et al.
patent: 3784536 (1974-01-01), Akin et al.
patent: 3809614 (1974-05-01), Forss et al.
patent: 3870805 (1975-03-01), Hayes et al.

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