Dielectric composition

Details Dielectric composition Dielectric composition

1985-03-25

1987-03-31

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156242, 156246, 501 15, 501 17, 501 20, 501 22, 501 61, 501 62, 501 73, 501 76, 501102, 501103, 501128, 501133, B32B 1800

Patent

active

046540954

ABSTRACT:
A dielectric composition comprising an admixture of finely divided solids comprising (a) a noncrystallizable glass of which the deformation temperature (T.sub.d) is 580.degree.-625.degree. C. and the softening point (T.sub.s) is 630.degree.-700.degree. C., and (T.sub.s -T.sub.d) is 50.degree.-75.degree. C., and (b) a refractory which is substantially insoluble in the glass at temperatures of 825.degree.-900.degree. C.

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