Die-to-die interconnect interface and protocol for stacked...

Details Die-to-die interconnect interface and protocol for stacked... Die-to-die interconnect interface and protocol for stacked...

2005-11-14

2010-06-22

Patel, Niketa I (Department: 2181)

Electrical computers and digital data processing systems: input/

Input/output data processing

Input/output command process

C710S018000

Reexamination Certificate

active

07743172

ABSTRACT:
A system and method for a die-to-die interconnect interface and protocol for stacked semiconductor dies. One preferred embodiment comprises an integrated circuit (IC) package comprising a first semiconductor die that includes an interface to a memory-mapped device, a second semiconductor die that does not include an interface to a memory mapped device, and a data bus coupling the first semiconductor die to the second semiconductor die (the data bus used to transfer a control word and a data word). The control word comprises a data word start address that corresponds to a location in the memory-mapped device. The data word is transferred from the second semiconductor die to the first semiconductor die and is stored by the first semiconductor die at the location in the memory-mapped device. Both semiconductor dies are mounted within the IC package.

REFERENCES:
patent: 5212373 (1993-05-01), Fujioka et al.
patent: 6121814 (2000-09-01), Henry
patent: 6304923 (2001-10-01), Klein
patent: 6480131 (2002-11-01), Roper et al.
patent: 6851009 (2005-02-01), Regula
patent: 7296124 (2007-11-01), Falik
patent: 2002/0121679 (2002-09-01), Bazarjani et al.
patent: 2004/0230850 (2004-11-01), Baumgartner et al.
patent: 0 490 573 (1992-06-01), None

Affiliated with

Also associated with

Rating

Die-to-die interconnect interface and protocol for stacked... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die-to-die interconnect interface and protocol for stacked..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die-to-die interconnect interface and protocol for stacked... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4177521