Die paddle heat sink with thermal posts

Details Die paddle heat sink with thermal posts Die paddle heat sink with thermal posts

1999-02-25

2000-05-09

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361702, 361737, 361773, 361760, 257678, 257707, 257723, 174 163, H05K 720

Patent

active

060612428

ABSTRACT:
A semiconductor device having a die paddle and a die disposed on the die paddle. The die paddle serves as a heat dissipation device and the die paddle is partially and/or fully encapsulated by a package body. Thermal posts extend from the die paddle to direct heat from the semiconductor device to a printed circuit board and further provide stability and alignment during placement of the semiconductor device on the printed circuit board.

REFERENCES:
patent: 5305179 (1994-04-01), Sono et al.
patent: 5359493 (1994-10-01), Chiu
patent: 5394607 (1995-03-01), Chiu et al.
patent: 5402006 (1995-03-01), O'Donley
patent: 5432678 (1995-07-01), Russel et al.
patent: 5458716 (1995-10-01), Alfaro et al.
patent: 5605863 (1997-02-01), Wills et al.
patent: 5650915 (1997-07-01), Alfaro et al.
patent: 5708567 (1998-01-01), Shim et al.
patent: 5798570 (1998-08-01), Watanabe et al.
patent: 5827999 (1998-10-01), McMillan et al.

Affiliated with

Also associated with

Rating

Die paddle heat sink with thermal posts does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die paddle heat sink with thermal posts, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die paddle heat sink with thermal posts will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1071337