Die for extrusion-molding and method for manufacturing...

Plastic and nonmetallic article shaping or treating: processes – Forming continuous or indefinite length work – Shaping by extrusion

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C425S461000

Reexamination Certificate

active

07842213

ABSTRACT:
A die for extrusion-molding in accordance with the present invention comprises: a molding groove part, a material supplying part, and an outer frame for fixing a die main body comprising the molding groove part and the material supplying part to the front end of an extrusion-molding apparatus, whereinthe die main body has a form in which the plate-shaped molding groove part smaller than the material supplying part is provided at almost the middle of the plate-shaped material supplying part such that it protrudes from the material supplying part,the outer frame comprises: a die holding part which is provided such that it covers the material supplying part around the molding groove part; and a peripheral part which is provided near the die holding part, andsupposing that the thickness of the molding groove part is X, the thickness of the material supplying part is Y, and the thickness of the die holding part of the outer frame is Z, these X, Y and Z are allowed to satisfy the inequalities (1) about 3≦X≦about 6, (2) about 5≦Y≦about 10, (3) about 3.5≦Z≦about 8.5, (4) about 0.8<Y/X<about 2.5, and (5) about 1<Z/X<about 2.

REFERENCES:
patent: 4478564 (1984-10-01), Shinmoto
patent: 4741792 (1988-05-01), Matsuhisa et al.
patent: 4810458 (1989-03-01), Oshima et al.
patent: 4814187 (1989-03-01), Inoue et al.
patent: 5914187 (1999-06-01), Naruse et al.
patent: 6193497 (2001-02-01), Suzuki
patent: 6669751 (2003-12-01), Ohno et al.
patent: 7112233 (2006-09-01), Ohno et al.
patent: 7309370 (2007-12-01), Kudo et al.
patent: 7311510 (2007-12-01), Nate et al.
patent: 7332014 (2008-02-01), Ono et al.
patent: 7341614 (2008-03-01), Hayashi et al.
patent: 7348049 (2008-03-01), Yoshida
patent: 7387829 (2008-06-01), Ohno et al.
patent: 7393376 (2008-07-01), Taoka et al.
patent: 7396586 (2008-07-01), Ohno et al.
patent: 7427308 (2008-09-01), Taoka et al.
patent: 7427309 (2008-09-01), Ohno et al.
patent: 7431873 (2008-10-01), Nate et al.
patent: 7438967 (2008-10-01), Fujita
patent: 7449427 (2008-11-01), Ohno et al.
patent: 7462216 (2008-12-01), Kunieda et al.
patent: 7473465 (2009-01-01), Ohno et al.
patent: 2002/0185776 (2002-12-01), Shibagaki et al.
patent: 2004/0161596 (2004-08-01), Taoka et al.
patent: 2005/0109023 (2005-05-01), Kudo et al.
patent: 2005/0147707 (2005-07-01), Nate et al.
patent: 2005/0153099 (2005-07-01), Yamada
patent: 2005/0167880 (2005-08-01), Nate et al.
patent: 2005/0169819 (2005-08-01), Shibata
patent: 2005/0175514 (2005-08-01), Ohno
patent: 2005/0180898 (2005-08-01), Yamada
patent: 2005/0247038 (2005-11-01), Takahashi
patent: 2005/0272602 (2005-12-01), Ninomiya
patent: 2006/0029897 (2006-02-01), Saijo et al.
patent: 2006/0029898 (2006-02-01), Saijo et al.
patent: 2006/0043562 (2006-03-01), Watanabe
patent: 2006/0051556 (2006-03-01), Ohno et al.
patent: 2006/0073970 (2006-04-01), Yamada
patent: 2006/0108347 (2006-05-01), Koyama et al.
patent: 2006/0118546 (2006-06-01), Saijo
patent: 2006/0166820 (2006-07-01), Ogyu et al.
patent: 2006/0210765 (2006-09-01), Ohno et al.
patent: 2006/0216466 (2006-09-01), Yoshida
patent: 2006/0216467 (2006-09-01), Yoshida
patent: 2006/0222812 (2006-10-01), Koyama et al.
patent: 2006/0225390 (2006-10-01), Yoshida
patent: 2006/0230732 (2006-10-01), Kunieda
patent: 2006/0245465 (2006-11-01), Saijo et al.
patent: 2006/0269722 (2006-11-01), Yamada
patent: 2007/0020155 (2007-01-01), Ohno et al.
patent: 2007/0028575 (2007-02-01), Ohno et al.
patent: 2007/0044444 (2007-03-01), Oshimi
patent: 2007/0068128 (2007-03-01), Oshimi et al.
patent: 2007/0116908 (2007-05-01), Ohno et al.
patent: 2007/0126160 (2007-06-01), Takahashi
patent: 2007/0128405 (2007-06-01), Sakaguchi et al.
patent: 2007/0130897 (2007-06-01), Sakaguchi et al.
patent: 2007/0144561 (2007-06-01), Saijo et al.
patent: 2007/0148403 (2007-06-01), Yamamura et al.
patent: 2007/0152382 (2007-07-01), Yamada et al.
patent: 2007/0169453 (2007-07-01), Hayakawa
patent: 2007/0175060 (2007-08-01), Idei et al.
patent: 2007/0178275 (2007-08-01), Takahashi
patent: 2007/0187651 (2007-08-01), Naruse et al.
patent: 2007/0190350 (2007-08-01), Ohno et al.
patent: 2007/0196620 (2007-08-01), Ohno et al.
patent: 2007/0199205 (2007-08-01), Hoshino et al.
patent: 2007/0204580 (2007-09-01), Kunieda
patent: 2007/0212517 (2007-09-01), Ohno et al.
patent: 2007/0235895 (2007-10-01), Yamamura et al.
patent: 2007/0243283 (2007-10-01), Yamamura et al.
patent: 2007/0262498 (2007-11-01), Saijo et al.
patent: 2007/0293392 (2007-12-01), Ohno et al.
patent: 2008/0067725 (2008-03-01), Naruse et al.
patent: 2008/0084010 (2008-04-01), Naruse et al.
patent: 2008/0088072 (2008-04-01), Kobayashi
patent: 2008/0106008 (2008-05-01), Kasai et al.
patent: 2008/0106009 (2008-05-01), Naruse et al.
patent: 2008/0120950 (2008-05-01), Ohno et al.
patent: 2008/0136062 (2008-06-01), Kasai et al.
patent: 2008/0138567 (2008-06-01), Ninomiya et al.
patent: 2008/0174039 (2008-07-01), Saijo et al.
patent: 2008/0190081 (2008-08-01), Oshimi
patent: 2008/0190083 (2008-08-01), Oshimi
patent: 2008/0213485 (2008-09-01), Shibata
patent: 2008/0236115 (2008-10-01), Sakashita
patent: 2008/0236122 (2008-10-01), Ito
patent: 2008/0236724 (2008-10-01), Higuchi
patent: 2008/0241015 (2008-10-01), Kudo et al.
patent: 2008/0241444 (2008-10-01), Oshimi
patent: 2008/0241466 (2008-10-01), Saito et al.
patent: 2008/0284067 (2008-11-01), Naruse et al.
patent: 2008/0305259 (2008-12-01), Saijo
patent: 2008/0318001 (2008-12-01), Sakakibara
patent: 2009/0004431 (2009-01-01), Ninomiya
patent: 198 10 076 (1998-10-01), None
patent: 1 500 479 (2005-01-01), None
patent: 53-106711 (1978-09-01), None
patent: 61108508 (1986-05-01), None
patent: 05-131424 (1993-05-01), None
patent: 08-090534 (1996-04-01), None
patent: 08-336819 (1996-12-01), None
patent: 2002-283327 (2002-10-01), None
Machine translations of: JP 2000-326318.
Machine translations JP 05-131424, and JP 08-336819.
Machine translation of JP 07-246610.
Machine translation of JP 08-090534.
Related case list.
U.S. Appl. No. 11/174,483, unpublished, Saijo et al.
U.S. Appl. No. 11/225,197.
U.S. Appl. No. 11/174,483.
European Search Report.
U.S. Appl. No. 11/925,350.
U.S. Appl. No. 11/927,046.
U.S. Appl. No. 11/931,935.
U.S. Appl. No. 11/845,975.
U.S. Appl. No. 11/867,256.
U.S. Appl. No. 11/963,381.
Summons to attend oral proceedings pursuant to Rule 115(1) EPC to be held Jan. 20, 2009 re European Application No. 06018111.2-1253, Aug. 20, 2008.
U.S. Appl. No. 11/695,246.
U.S. Appl. No. 11/749,961.
U.S. Appl. No. 11/748,099.
U.S. Appl. No. 11/746,895.
U.S. Appl. No. 11/513,115.
U.S. Appl. No. 11/762,928.
U.S. Appl. No. 11/765,088.
U.S. Appl. No. 11/546,417.
U.S. Appl. No. 11/711,021.
U.S. Appl. No. 11/951,949.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Die for extrusion-molding and method for manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die for extrusion-molding and method for manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die for extrusion-molding and method for manufacturing... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4151097

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.