Die bonding method and apparatus

Details Die bonding method and apparatus Die bonding method and apparatus

2006-08-08

2006-08-08

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C029S833000

Reexamination Certificate

active

07087457

ABSTRACT:
A die bonding method and apparatus that performs bonding position detection and bonding inspection without lowering the productivity, in which after a bonding head has bonded a semiconductor chip to an island, the bonding head is moved to a wafer to pick up a semiconductor chip and is returned to the island; and during this period, an island used for bonding inspection (that is the island on which bonding has just been performed) and an island used for position detection (that is the island on which bonding is to be done next) are imaged by a camera in the same visual field, and inspection of the bonding conditions of the island used for inspection and detection of the position of the island used for position detection are performed based on the acquired image data.

REFERENCES:
patent: 5946409 (1999-08-01), Hori
patent: 6389688 (2002-05-01), Srivastava et al.
patent: 2001/0051394 (2001-12-01), Kim et al.
patent: 2003/0029033 (2003-02-01), Hidese et al.
patent: 2003/0110623 (2003-06-01), Haji et al.
patent: 06-132325 (1994-05-01), None

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