Dicing die-bonding film

Details Dicing die-bonding film Dicing die-bonding film

2011-01-04

2011-01-04

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

07863182

ABSTRACT:
The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein the adhesion of the pressure-sensitive adhesive layer (2) to the die-bonding adhesive layer (3), as determined under the conditions of a peel angle of 15° and a peel point moving rate of 2.5 mm/sec. at 23° C., is different between a region (2a) corresponding to a work attachment region (3a) and a region (2b) corresponding to a part or the whole of the other region (3b), in the die-bonding adhesive layer (3), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer (2a) <adhesion of the pressure-sensitive adhesive layer (2b), and the adhesion of the pressure-sensitive adhesive layer (2a) to the die-bonding adhesive layer (3) is not higher than 2.3 N/25 mm.

REFERENCES:
patent: 4664739 (1987-05-01), Aurichio
patent: 4687693 (1987-08-01), Sheyon et al.
patent: 4961804 (1990-10-01), Aurichi
patent: 5098501 (1992-03-01), Nishiguchi
patent: 5304418 (1994-04-01), Akada et al.
patent: 5476565 (1995-12-01), Akada et al.
patent: 5525422 (1996-06-01), Spies et al.
patent: 5705016 (1998-01-01), Senoo et al.
patent: 5844348 (1998-12-01), Gamo
patent: 5888606 (1999-03-01), Senoo et al.
patent: 6007920 (1999-12-01), Umehara et al.
patent: 6140151 (2000-10-01), Akram
patent: 6159827 (2000-12-01), Kataoka et al.
patent: 6171163 (2001-01-01), Seko et al.
patent: 6245593 (2001-06-01), Yoshihara et al.
patent: 6258426 (2001-07-01), Yamamoto et al.
patent: 6398892 (2002-06-01), Noguchi et al.
patent: 6457220 (2002-10-01), Hamano
patent: 6528330 (2003-03-01), Iketani
patent: 6548327 (2003-04-01), De Pauw et al.
patent: 6938783 (2005-09-01), Chung
patent: 6977024 (2005-12-01), Yamazaki et al.
patent: 7054161 (2006-05-01), James
patent: 7060339 (2006-06-01), Matsumura et al.
patent: 7135224 (2006-11-01), Sumi et al.
patent: 7147920 (2006-12-01), Shiobara et al.
patent: D549189 (2007-08-01), Misumi et al.
patent: 7309925 (2007-12-01), Matsumura et al.
patent: 7429522 (2008-09-01), Matsumura et al.
patent: 7449226 (2008-11-01), Matsumura et al.
patent: 7452752 (2008-11-01), Noda et al.
patent: 7508081 (2009-03-01), Matsumura et al.
patent: 2002/0001670 (2002-01-01), Pauw et al.
patent: 2002/0014465 (2002-02-01), Chung
patent: 2002/0042189 (2002-04-01), Tanaka
patent: 2003/0054643 (2003-03-01), Aihara et al.
patent: 2003/0064579 (2003-04-01), Miyakawa et al.
patent: 2003/0207479 (2003-11-01), Border et al.
patent: 2003/0226640 (2003-12-01), Yamazaki et al.
patent: 2004/0023043 (2004-02-01), Ishikawa et al.
patent: 2004/0105990 (2004-06-01), Shiobara et al.
patent: 2004/0230000 (2004-11-01), Misumi et al.
patent: 2004/0232563 (2004-11-01), Sumi et al.
patent: 2004/0241910 (2004-12-01), Matsumura et al.
patent: 2005/0046042 (2005-03-01), Matsumura et al.
patent: 2005/0139973 (2005-06-01), Matsumura et al.
patent: 2005/0208736 (2005-09-01), Matsumura et al.
patent: 2005/0224978 (2005-10-01), Kawate et al.
patent: 2005/0227064 (2005-10-01), Jin
patent: 2006/0029762 (2006-02-01), Chung
patent: 2006/0148131 (2006-07-01), Matsumura et al.
patent: 2006/0252234 (2006-11-01), Saiki
patent: 2006/0257651 (2006-11-01), Shintani et al.
patent: 2007/0003758 (2007-01-01), Jin
patent: 2007/0077685 (2007-04-01), Noda et al.
patent: 2007/0090299 (2007-04-01), Kozakai et al.
patent: 2007/0104972 (2007-05-01), Shinohara et al.
patent: 2007/0120271 (2007-05-01), Kozakai et al.
patent: 2007/0137782 (2007-06-01), Matsumura et al.
patent: 2007/0218299 (2007-09-01), Azechi
patent: 2008/0088036 (2008-04-01), Matsumura et al.
patent: 2008/0090085 (2008-04-01), Kawate et al.
patent: 2008/0108721 (2008-05-01), Ha et al.
patent: 0 150 882 (1985-08-01), None
patent: 0 134 606 (1989-03-01), None
patent: 0 550 014 (1993-07-01), None
patent: 0 571 649 (1993-12-01), None
patent: 0 588 180 (1994-03-01), None
patent: 0 786 802 (1997-07-01), None
patent: 0 792 756 (1997-09-01), None
patent: 0 884 766 (1998-12-01), None
patent: 0 976 802 (2000-02-01), None
patent: 1 411 547 (2004-04-01), None
patent: 1 482 546 (2004-12-01), None
patent: 1 583 144 (2005-10-01), None
patent: 2 340 772 (2000-03-01), None
patent: 60-57642 (1985-04-01), None
patent: 60-196956 (1985-10-01), None
patent: 61-263136 (1986-11-01), None
patent: 62-79649 (1987-04-01), None
patent: 1-268131 (1989-10-01), None
patent: 2-248064 (1990-10-01), None
patent: 2-265258 (1990-10-01), None
patent: 4-042555 (1992-02-01), None
patent: 5-078629 (1993-03-01), None
patent: 7-263382 (1995-10-01), None
patent: 8-213349 (1996-08-01), None
patent: 10-335271 (1998-12-01), None
patent: 11-111162 (1999-04-01), None
patent: 2002-158276 (2002-05-01), None
patent: 2002-226800 (2002-08-01), None
patent: 2002-235055 (2002-08-01), None
patent: 2003-007646 (2003-01-01), None
patent: 2003-119438 (2003-04-01), None
patent: 2003-206468 (2003-07-01), None
patent: 2003-316031 (2003-11-01), None
patent: 2004-063953 (2004-02-01), None
patent: 2004-134689 (2004-04-01), None
patent: 2004-186429 (2004-07-01), None
patent: 2003-56248 (2004-09-01), None
patent: 2004-349510 (2004-12-01), None
patent: 2005-005355 (2005-01-01), None
patent: 2005-159069 (2005-06-01), None
patent: 2005-268434 (2005-09-01), None
patent: 2006-012998 (2006-01-01), None
patent: 2006-128621 (2006-05-01), None
patent: 2007-035852 (2007-02-01), None
patent: 2007-123914 (2007-05-01), None
patent: 20040034479 (2004-04-01), None
Chinese Office Action issued on the related Chinese Patent Application No. 200410098297.6, dated Sep. 28, 2007.
Decision of Refusal issued on the related Japanese Patent Application No. 2003-152659, dated Oct. 30, 2007.
European Search Report issued on the corresponding European Patent Application No. 05005884.1, dated Jun. 23, 2006.
European Search Report issued on the related European Patent Application No. EP03023536, dated Jul. 27, 2004.
European Search Report issued on the related European Patent Application No. 03023536, dated Aug. 9, 2004.
European Search Report issued on the related European Patent Application No. EP04012260, dated Jan. 4, 2005.
European Search Report issued on the related European Patent Application No. 05 00 5884, dated Jun. 14, 2006.
Japanese Office Action issued on the related Japanese Patent Application No. 2003-431690, dated Jun. 26, 2007.
Japanese Office Action issued on the related Japanese Patent Application No. 2003-431690, dated Jan. 18, 2007.
Japanese Office Action issued on the related Japanese Patent Application No. 2003-431690, dated Oct. 30, 2007.
Notification of Reasons for Refusal issued on the related Japanese Patent Application No. 2003-52659, dated Sep. 27, 2006.
Written Opinion issued by the Austrian Patent Office on the related Singapore Patent Application No. 200402611-8, dated Apr. 13, 2007.
File History of the related U.S. Appl. No. 11/369,931, for the period of Feb. 16, 2008-Feb. 9, 2009.
File History of the related U.S. Appl. No. 11/671,982, for the period ofFeb. 16, 2008-Feb. 9, 2009.
File History of the related U.S. Appl. No. 29/225,424, for the period of Aug. 20, 2008-Feb. 9, 2009.
File History of the related U.S. Appl. No. 11/369,931, for the period of Feb. 10, 2009-Jul. 20, 2009.
File History of the related U.S. Appl. No. 11/671,982, for the period of Feb. 10, 2009-Jul. 20, 2009.
File History of the related U.S. Appl. No. 29/225,424, for the period of Feb. 10, 2009-Jul. 20, 2009.
File History of the related U.S. Appl. No. 12/440,595, as of Jul. 22, 2009.

Affiliated with

Also associated with

Rating

Dicing die-bonding film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dicing die-bonding film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dicing die-bonding film will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2642894