Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-11-27
1986-12-23
Kimlin, Edward
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156633, 156644, 156655, 1566611, 430312, 430313, 430315, 430503, 427 97, 427 98, B44C 122, B29C 1708, G03C 500
Patent
active
046311114
ABSTRACT:
Process for preparation of conductive circuit utilizing two photohardenable layers on substrate which may contain a conductive circuit, the upper photohardenable layer becoming hardenable and nontacky when exposed to short wavelengths of radiation (ultraviolet) the lower photohardenable layer being tacky and sensitive to long wavelength radiation (visible light). The photohardenable layers are imagewise exposed through a dichromic phototool (black/yellow also having clear areas) and the unhardened image areas are solvent developed revealing tacky areas. The tacky areas are treated with metal or alloy particles or plating catalyst material, and the metallized or catalyzed image is electrolessly plated. Multilayer conductive circuits can be prepared.
REFERENCES:
patent: 3751248 (1973-08-01), Goell
patent: 4411980 (1983-10-01), Haney et al.
patent: 4469777 (1984-09-01), O'Neil
patent: 4572764 (1986-02-01), Fan
E. I. Du Pont de Nemours and Company
Hoch Ramon R.
Kimlin Edward
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