Device to monitor and control the temperature of electronic chip

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Temperature

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257712, 257713, 257469, 257930, 361688, 361717, 361718, 361719, H01L 31058

Patent

active

055699502

ABSTRACT:
Device to monitor and control the temperature of electronic chips to enhance reliability including a thermal electric cooling device in which the cold side is thermally secured to the chip and the hot side is attached to a heat sink. A thermocouple is sandwiched between the TEC device and the chip and a feedback control circuit is connected between the thermocouple and the voltage source which applies a potential to the TEC device to maintain the chip at the desired substantially constant temperature.

REFERENCES:
patent: 4685081 (1987-08-01), Richman
patent: 4704872 (1987-11-01), Jones
patent: 5028988 (1991-07-01), Porter et al.
patent: 5032897 (1991-07-01), Mansuria et al.
patent: 5065085 (1991-11-01), Aspden et al.
patent: 5079618 (1992-01-01), Farnworth
No Author, "Thermoelectric Temperature Cycler For Chip Functional Testing," Research Disclosure, Mar. 1989, No. 299.
Skobern, "Thermoelectrically Cooled Module," IBM Technical Disclosure Bulletin, vol. 27, No. 1A, Jun. 1984, p. 30.

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