Device, system and method of thermal control

Electrical computers and digital processing systems: support – Computer power control

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C700S299000

Reexamination Certificate

active

07461272

ABSTRACT:
Briefly, some embodiments of the invention may provide devices, systems and methods for thermal control. For example, a method in accordance with an embodiment of the invention may include modifying an operational parameter of a processor based on a temperature of a heat sink associated with the processor.

REFERENCES:
patent: 6058012 (2000-05-01), Cooper et al.
patent: 6928559 (2005-08-01), Beard
Gochman et al. “The Intel (RTM) Pentium (RTM) M Processor: Microarchitecture and Performance” Intel Technology Journal, vol. 07, Issue 02 Published on May, 21, 2003 ISSN 1535-864X Available online at: www.Intel.com/technology/itj/2003/volume07issue02/art03—pentiumm/p10—speedstep.htm.
K. Skadron, T. Abdelzaher, M. R. Stan “Control-Theoretic Techniques and Thermal RC modeling for Accurate and Localized Dynamic Thermal Management” Published in the Proceedings of the Eighth International Symposium on High-Performance Computer Architecture (HPCA) Feb. 2002.
“Advanced Configuration and Power Interface (ACPI) Specification” Hewlett-Packard Corporation, Intel Corporation, Microsoft Corporation, Phoenix Technologies Ltd., Toshiba Corporation Revision 3.0, Sep. 2, 2004 Table of Contents, and Chapter 11, pp. 325-352 Available online at: www.ACPI.info/spec/htm.
Skadron et al. “Temperature-Aware Microarchitecture” In the Proceedings of the 30th International Symposium on Computer Architecture Jun. 2003 pp. 1-12.
“ACPI Overview” Available online at: www.ACPI.info/over.htm.
“Intel SpeedStep Technology Backgrounder” pp. 1-3.
Intel Low Power Technologies for Mobile PCs pp. 1-7.
“Intel Processor Packages for Mobile PCs” p. 1.
“Intel Mobile Cooling Technology Provides Higher Performance in Thinner and Cooler Notebooks” pp. 1-6.
“Standard Performance Evaluation Corporation (SPEC) CPU2000 version 1.2” Documentation Published by SPEC on Oct. 30, 2001 Available online at: www.SPEC.org/cpu2000/docs.
“Device Driver Power and Performance Management—White Paper” Intel Corporation Aug. 21, 2001 pp. 1-23.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Device, system and method of thermal control does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Device, system and method of thermal control, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Device, system and method of thermal control will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4035322

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.