Device separation structure and semiconductor device improved in

Details Device separation structure and semiconductor device improved in Device separation structure and semiconductor device improved in

1994-11-16

1997-09-09

Bowers, Jr., Charles L.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438675, 438233, H01L 2176

Patent

active

056656300

ABSTRACT:
A semiconductor device has a device region, and a device separation region formed on a semiconductor substrate doped with impurities. And, the device separation region has a metal wiring formed on the surface of the device region or the back surface of the substrate. An aluminum region extending in the longitudinal direction connected to the metal wiring is formed within the device separation region.

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