Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-06-26
2007-06-26
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Reexamination Certificate
active
11049246
ABSTRACT:
Devices such as amplifiers are built on a heat sink having a perimeter wall surrounding active electronic devices. Surprisingly formation of wire bonds to such devices tends to be degraded if they have an aspect ratio greater than 2:1. This problem is overcome by forming wire bonds before such walls have a height of 30 mils and after bond formation extending the walls to their final height.
REFERENCES:
patent: 3002320 (1961-10-01), Theuerer
patent: 6246115 (2001-06-01), Tang et al.
patent: 6399182 (2002-06-01), Rubel et al.
Brennan John M.
Freund Joseph Michael
Gilbert Jeffrey John
Osenbach John William
Safar Hugo Fernando
Agere Systems Inc.
Harrison Monica D.
Jr. Carl Whitehead
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