Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2008-04-22
2008-04-22
Pizarro, Marcos D. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S690000, C257S738000, C257S780000, C257SE23069
Reexamination Certificate
active
07361997
ABSTRACT:
A device package, such as a BGA, to be mounted on a printed wiring board (PWB) is disclosed. The bottom electrodes of the device package are arranged in an array such that intervals between the edges of the bottom electrodes become different from place to place. The intervals may be set wider at the peripheral positions of the bottom electrodes. The PWB includes pads that are located at positions corresponding to the bottom electrodes.
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Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Pizarro Marcos D.
Ricoh & Company, Ltd.
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